Failure Analysis and Materials Characterization

We have extensive experience in the field of materials characterization and its applications to failure analysis, both for thin-film device structures and bulk materials.  Included is a partial list of analytical techniques we have employed for materials characterization and failure analysis:

• FESEM/SEM (EDX, WDX)
• TEM/STEM (EDX, EELS, electron diffraction)
• Focused Ion Beam (FIB)
• SIMS
• Auger Electron Spectroscopy
• Ellipsometry (single wavelength and spectroscopic)
• Reflectometry
• Profilometry
• Atomic Force Microscopy (AFM)
• Cantilever Method for Thin-Film Stress Determination
• ICP (MS and UV detectors)
• Atomic Absorption Spectroscopy (AAS)
• DTA/TGA
• XRF
• FTIR (for bulk materials and thin-films)
• Raman Spectroscopy
• Thin-Film XRD Methods (Q-2Q, rocking-curve, pole-figure)
• Powder XRD
• Liquid and Solid State NMR
• Various Elemental Analyses (e.g., fluoride ion selective electrode)
• Gas Chromatography (FID & PID detectors)
• Viscometry (Ostwald and rotating drum)
• Moessbauer Spectroscopy
• UV/Vis/NIR Spectroscopy

Next Category....